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Deep reactive-ion etching
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21	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
22	FractureGate: Fracture Fabrication of Single Crystal Silicon Nanosurfaces Alexander D. Sprunt & Alexander H. Slocum MIT Mechanical Engineering – Precision Engineering Research Group Room 3-470, 77 Massachusetts Avenue, Add to Reading List Source URL: cba.mit.edu Language: English - Date: 2011-12-13 18:50:17 Mechanics Semiconductor device fabrication Glass physics Fracture Microelectromechanical systems Bone fracture Deep reactive-ion etching Materials science Physics Microtechnology
23	PDF Document Add to Reading List Source URL: nanomelbourne.com Language: English - Date: 2012-08-28 20:43:03 Structural system Melbourne Centre for Nanofabrication Technology Deep reactive-ion etching Nanotechnology Materials science Cantilever
24	Chemical Name Index XI Library of Digital XPS Spectra Copyright © January 1997 XPS International Add to Reading List Source URL: www.xpsdata.com Language: English - Date: 2008-05-21 17:29:42 Technology Etching Deep reactive-ion etching Microtechnology Semiconductor device fabrication Materials science
25	PDF Document Add to Reading List Source URL: www.hisglassworks.com Language: English - Date: 2014-10-13 15:22:07 Semiconductor device fabrication Etching Technology Deep reactive-ion etching Glass etching Glass Visual arts Materials science Microtechnology
26	3D IC WORKING GROUP MEETING OCTOBER 22, 2014 3D IC Working Group Meeting Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:12:03 Three-dimensional integrated circuit Technology Deep reactive-ion etching Semiconductor device fabrication Microtechnology Materials science
27	High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Russell Shumway Director- MEMS & Sensor Products Office: Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:45:23 Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Wafer bonding Flip chip Deep reactive-ion etching Amkor Technology Materials science Technology Microtechnology
28	MEMS Working Group March 26, 2015 Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-03-27 15:12:53 Technology Electromagnetism Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Deep reactive-ion etching Microelectromechanical system oscillator Nasiri-Fabrication Microtechnology Materials science Semiconductor device fabrication
29	A FULLY DRY SELF-ASSEMBLY PROCESS WITH PROPER IN-PLANE ORIENTATION Sangjun Park and Karl F. Bö Böhringer Department of Electrical Engineering University of Washington, Seattle, WA[removed] Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2008-01-10 14:48:22 Technology Deep reactive-ion etching Etching Microfabrication Wafer Isotropic etching Passivation Microelectromechanical systems Semiconductor device fabrication Materials science Microtechnology
30	SELF-ASSEMBLY OF MICRO PUMPS WITH HIGH UNIFORMITY IN PERFORMANCE Jiandong Fang, Kerwin Wang, Karl F. Böhringer Department of Electrical Engineering University of Washington Seattle, WA[removed] Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2004-03-16 02:48:00 Semiconductor device fabrication Physics Transducers Nanotechnology Mechanical engineering Microelectromechanical systems Deep reactive-ion etching Piezoelectricity Pump Materials science Chemistry Microtechnology